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Product category: Analogue and Mixed Signal ICs
News Release from: Wolfson Microelectronics | Subject: WM8986
Edited by the Electronicstalk Editorial Team on 09 January 2007
Audio DAC saves space with chip-on-lead
packaging
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Class D device provides a space saving of up to 36% PCB real estate in compact portable devices.
Wolfson Microelectronics has introduced its first Class D device offered in chip-on-lead (COL) packaging, so small and thin that, compared with the previous generation of parts, it provides a space saving of up to 36% PCB real estate in compact portable devices The WM8986 DAC is supplied in a 4 x 4 x 0.75mm COL QFN package that can support a larger die than a standard QFN, or allow a die to be placed in a package with a smaller outline than would be required with a QFN