Product category: Analogue and Mixed Signal ICs
News Release from: Wolfson Microelectronics | Subject: QFN package
Edited by the Electronicstalk Editorial Team on 15 January 2002
Novel package shrinks
low-pin-count audio devices
Wolfson Microelectronics is meeting demand for ever-smaller audio and multimedia designs, with the addition of ultraminiature quad flat no-lead packaging for key devices in its product family
Wolfson Microelectronics is meeting demand for ever-smaller audio and multimedia designs, with the introduction of ultraminiature quad flat no-lead (QFN) packaging for key devices in the product family. Offering a 60% smaller footprint compared with existing quad flatpack ICs, the QFN is a chip-scale package featuring a plastic encapsulated lead frame, with a pad of leads on the base providing connection to the printed circuit board.
This article was originally published on Electronicstalk on 15 January 2002 at 8.00am (UK)
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Advantages for smaller pin count devices include simpler manufacturing (with fewer process steps), more robust construction than BGA (no balls to break off) and easier debugging.
In addition to lower surface area, the devices are also very thin, typically 0.9mm high.
Short electrical paths between inner leads and wires ensure good electrical performance, while heat dissipation is enhanced by an optional exposed die pad, which provides an efficient thermal path soldered to the PCB.
The first Wolfson devices to benefit include the WM8711 stereo DAC and WM8731 audio codec, both having integrated headphone driver circuitry.
These are widely used in portable audio designs, such as MP3 players and speech record/store devices.
Previously offered in 28-pin SSOP packages, these will now be available in 5 x 5mm QFNs.
The reduction on area is dramatic -SSOPs require a 10.2 x 7.8mm footprint and also double the headroom of 0.9mm-high QFNs.
Later this year, Wolfson will introduce 7 x 7mm QFN packaging as an alternative to 48-pin TQFP, as used with the WM9705 Multimedia AC97 codec, The company plans to extend the new packaging technology throughout the portable product range.
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