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Product category: Terminals and Power
News Release from: Wago Corp | Subject: 236 Series
Edited by the Electronicstalk Editorial Team on 20 April 2004
Terminals suit through-hole reflow
process
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A new range of terminals helps provide a cost-effective solution for surface mount technology assembly processes.
A new range of terminals helps provide a cost-effective solution for surface mount technology assembly processes Key design elements incorporated into the Wago 236 Series included optimising the solder pin length to adapt to the reflow process, and the use of high temperature resistant plastic for the insulating housing, in addition to using the proven labour savings realised with Wago's unique Cage Clamp spring pressure connection technology that reduces wiring and installation time by 60%