Product category: Discrete Power Devices
News Release from: Vishay Siliconix
Edited by the Electronicstalk Editorial Team on 14 March 2005
STMicroelectronics signs for packaging
technology
STMicroelectronics is to license a new power MOSFET packaging technology that provides superior thermal performance via top and bottom heat dissipation paths in systems using forced air cooling.
STMicroelectronics and Siliconix have concluded an agreement whereby ST will license from Siliconix a new power MOSFET packaging technology that provides superior thermal performance via top and bottom heat dissipation paths in systems using forced air cooling Offered by Siliconix under the PolarPAK name, the new package's leadframe and plastic encapsulation are similar to those used for most standard power MOSFET packages, ensuring good die protection and easy handling in manufacturing
This article was originally published on Electronicstalk on 13 Dec 2005 at 8.00am (UK)
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