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Product category: Communications ICs (Wired)
News Release from: Vitesse Semiconductor | Subject: SimpliPHY
Edited by the Electronicstalk Editorial Team on 2 May 2006

Physical layer device
cuts gigabit power budget

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Vitesse Semiconductor has successfully demonstrated the industry's first 400mW integrated Gigabit Ethernet PHY, lowering power consumption by up to 50% compared with previous solutions

Vitesse Semiconductor has successfully demonstrated the industry's first 400mW integrated gigabit Ethernet (GbE) PHY, lowering power consumption by up to 50% compared with previous solutions. Tested over full 100m cable lengths with continuous traffic, the prototype super low power GbE PHY reinforces Vitesse's technology leadership in GbE integrated circuits and will become the foundation for future products in the SimpliPHY and SparX families.

In February 2006 the company raised the bar on low power to 600mW for its SimpliPHY VSC8601 and VSC8641, and with this announcement Vitesse again sets the pace for the industry.

Vitesse will be demonstrating the 400mW GbE PHY during the Interop event in Las Vegas from 2nd to 4th May 2006 on Booth 125 ER01 at the Mandalay Bay Convention Centre.

'Vitesse's Ethernet Products Division is focused on accelerating the transition from 10/100 to Gigabit Ethernet while at the same time leveraging our technology expertise to bring strategic advantages to our customers through integration, performance and power', said Martyn Humphries, Vice President and General Manager of the Ethernet Products Division at Vitesse.

'By providing a super low power PHY, we are removing the barriers and enabling GbE in a much broader range of applications where power dissipation considerations previously prevented the use of this high-speed connectivity technology'.

Power savings in a highly integrated chip helps optimise PC board space and simplify board design to lower component count, improve reliability and performance, and reduce circuit and system risk.

Delivering 600mW in its current SimpliPHY VSC8601 and VSC8641 and now achieving the 400mW benchmark, Vitesse brings its OEM and ODM customers the industry's best performance, lowest power GbE chip on the market as well as the assurance that the company will continually improve on its leading GbE technology.

OEMs and ODMs can utilise the low power chips to build cost-effective solutions for a broader set of applications including power sensitive appliances such as laptops, PDAs and servers.

Vitesse marks its presence at Interop in Las Vegas by underscoring its technology leadership both through the demonstration of the 400mW GbE PHY and by showcasing its newly announced E-StaX-34 switch-on-a chip (SoC) product, the industry's first low cost stackable Layer 2 Gigabit Ethernet Smart Switch designed to bring affordable GbE to entry level applications.

The combination of the super low power GbE PHY and E-StaX-34 allows Vitesse to extend its customer reach to new OEMs and ODMs while building loyalty with existing customers by enhancing its value proposition with a diverse and industry-leading product line.

At the same time, Vitesse accelerates the transition to Gigabit Ethernet by making the technology more available and affordable.

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