Product category: Electronics Manufacturing Machinery and Materials
News Release from: Unitemp | Subject: Espec AMI series
Edited by the Electronicstalk Editorial Team on 3 May 2007
Evaluation systems assess assembly reliability
Ion migration and lead free solder evaluation systems address problems with high density assemblies using lead free solder
Available now from Unitemp, the Espec AMI series of ion migration and lead free solder evaluation systems are designed to help overcome the problems that occur as electronic devices are miniaturised and mounted with higher density and new lead free solder. The system detects the decline of insulation resistance by continuous measurement while applying voltage under high temperature and high humidity conditions.
This article was originally published on Electronicstalk on 3 May 2007 at 8.00am (UK)
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The leak detection function detects the occurrence of ion migration in microsecond intervals.
The stress voltage to the channel is immediately shut off when leak-touch is detected.
Other features include measuring applied voltage, stress charge voltage, continuous testing time, measuring time and current leak detection interval.
The system includes an international standard traceable precision measurement instrument to guarantee accurate and compatible measurement data.
Tests are simplified by interaction of the measurement with various environmental test chambers.
Up to three test chambers can be connected for testing specimens with real time monitoring of humidity and temperature.
Rapidly increasing the humidity at the beginning of the test can generate dew condensation on the specimen.
This problem is overcome by a delay control.
This easy to use system complements Unitemp's extensive range of test and monitoring chambers and/or ovens, and the company can also provide specials to customer requirements.
This system is primarily for use in the electronics industry but has applications in the engineering, process, manufacturing, laboratory and defence industries.
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