Product category: Boards and Backplanes
News Release from: UltraSource | Subject: UltraBridge technology
Edited by the Electronicstalk Editorial Team on 03 February 2006
Thin film substrates take more
components onboard
A novel multilayering approach provides repeatable wire-bond-less cross-under bridges and allows integration of circuit functions onto a single thin film substrate.
Modifying techniques traditionally reserved for costly MIMIC fabrication, UltraSource has perfected a novel thin film multilayering approach that has proven to provide repeatable, wire-bond-less, cross-under bridges, and has allowed for further integration of not only resistors, but also inductors, capacitors, and other circuit functions onto a single thin film substrate The key innovation from UltraSource is its UltraBridge technology
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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By eliminating the need for a wire bond, or an air bridge, this consistent, reliable, cost effective solution should aid circuit designers at high frequencies.
In this process, the interconnect conductor layer right is applied and patterned right on the substrate surface as an "under" bridge.
This is where this technique varies from an air bridge process, which applies the interconnect layer after the thin film conductor layer is complete.