Product category: PCB Assembly Equipment and Tools
News Release from: Universal Instruments
Edited by the Electronicstalk Editorial Team on 02 November 2004
Assembly equipment manufacturer presents
platform
Universal Instruments has presented Binghamton University's Thomas J. Watson School of Engineering and Applied Science with a high accuracy surface mount placement platform.
Universal Instruments Corporation, global manufacturer of electronics assembly equipment, has presented Binghamton University's Thomas J Watson School of Engineering and Applied Science with one of its leading-edge high accuracy surface mount placement platforms to support small systems packaging educational and research programs in the Department of Systems Science and Industrial Engineering (SSIE) and Integrated Electronics Engineering Center (IEEC)
This article was originally published on Electronicstalk on 17 Jul 2002 at 8.00am (UK)
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