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Product category: Communications ICs (Wireless)
News Release from: Texas Instruments (April 2006-) | Subject: Gen 2 silicon
Edited by the Electronicstalk Editorial Team on 2 August 2006

UHF chips pass test for global RFID

Texas Instruments has announced the availability of its EPCglobal certified Generation 2 (Gen 2) ultra-high-frequency (UHF) silicon

Using an advanced silicon design that improves tag performance and facilitates speed and visibility of retail supply chain goods, Texas Instruments has announced the availability of its EPCglobal certified Generation 2 (Gen 2) ultra-high-frequency (UHF) silicon. Offered in wafer and strap form factors, TI has developed its Gen 2 silicon on the most advanced analogue process node at 130nm and with a built-in Schottky diode for more efficient conversion of radio frequency (RF) signal energy.

The result is silicon chips with low power consumption and increased chip-to-reader sensitivity.

Users can also write to TI's chips under the lowest RF power conditions in spite of background electromagnetic interference (EMI) common in typical supply chain factory floor and warehouse environments.

Companies deploying UHF-based RFID systems based on TI's Gen 2 technology can potentially capture a greater percentage of reads on cases and pallets as they move through manufacturing and distribution channels.

With improved chip-to-reader sensitivity, companies can expect to more accurately track products and packages at all points throughout their supply chain operations and improve process flow.

TI's chip also delivers reliable read range performance across both standard and dense reader mode operations.

As a result, users are less constrained in the set-up and placement of RFID readers and can more readily achieve effective results and maximum read rates.

Offering greater design flexibility to customers, TI is providing its Gen 2 silicon to inlay, label and packaging manufacturers in three convenient forms: bare wafers to support various assembly processes; processed wafers (bumped, sawn with back grind) that are suitable for immediate use with commercially available inlay equipment; and silicon chip on straps for label and packaging manufacturers who are printing their own antennas.

TI is also offering reference antenna designs enabling customers to develop labels and tags which optimise its Gen 2 silicon.

'Users of EPC Gen 2 tags, from box and label manufacturers to distributors of consumer product goods, have different needs and expectations from RFID systems that power their supply chains'.

'With TI technology, they can take advantage of the form factor that is best suited for their manufacturing flow', said Tony Sabetti, Director of UHF/Retail Supply Chain, Texas Instruments RFID Systems.

'TI's Gen 2 chip is available in a variety of form factors that users will find convenient and flexible'.

TI has been awarded the EPCglobal Certification Mark for its new UHF Gen 2 silicon.

The certification mark signifies that TI's silicon has been tested and operates according to the EPCglobal Gen 2 Air Interface protocol standard ratified in December 2004.

Meeting all of the EPCglobal Gen 2 and ISO/IEC18000-6c required specifications with 192 bits of memory, this chip also goes beyond the standard requirements to provide additional functionality by supporting 'block write' and 'block erase' commands.

TI's Gen 2 silicon is intended for use in the manufacture of passive RFID tag products operating in the 860 to 960MHz.

frequency band.

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