Product category: Analogue and Mixed Signal ICs
News Release from: Texas Instruments (April 2006-)
Edited by the Electronicstalk Editorial Team on 13 June 2006
45nm process set to sample in 2007
A 45nm manufacturing process uses "wet" lithography to double the number of ICs produced on each silicon wafer, increase processing performance and reduce power consumption.
Before the start of the prestigious 2006 Symposium on VLSI Technology, Texas Instruments has unveiled details of a 45nm semiconductor manufacturing process that leverages a "wet" lithography process to double the number of chips produced on each silicon wafer, increase processing performance and reduce power consumption Through the use of numerous proprietary techniques, TI will drive the capabilities of its multi-million-transistor system-on-chip processors to new levels, increasing performance by 30% while reducing power consumption 40%
This article was originally published on Electronicstalk on 4 Apr 2006 at 8.00am (UK)
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"TI's strength in chip manufacturing has resulted in a cost-effective process that will deliver 45nm products, like mobile phone processors and DSPs that simultaneously address performance, power consumption and transistor density", said Dr Hans Stork, Senior Vice President and Chief Technology Officer, Texas Instruments.
"This gives our customers early access to faster, smaller and lower power products and continues TI's track record of delivering millions of units from high yielding wafers ahead of the industry".
TI estimates that its 45nm process and SoC integration capabilities will mean consumers can experience up to a 30% improvement in device speed, which can translate to more video frames per second for a better user experience on mobile phones.