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Product category: Communications ICs (Wired)
News Release from: Tundra Semiconductor
Edited by the Electronicstalk Editorial Team on 30 September 2003
Tundra helps Motorola with system
interconnect
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Tundra Semiconductor has signed a multi-million-dollar collaborative agreement with Motorola for the development of next generation PowerPC system interconnect technology.
Tundra Semiconductor has signed a multi-million-dollar collaborative agreement with Motorola for the development of next generation PowerPC system interconnect technology PowerPC technology is based on a high-performance processor bus specification