SoC service speeds PLC chipset design

Using Toshiba's advanced process technology and IP libraries, DS2 engineers were able to quickly integrate key onboard features including ADCs, DACs and PLL functionality.

In their second successful collaboration, DS2 has used Toshiba's renowned process technology including a special developed ADC, DAC and PLL for the rapid development of a next generation, low-cost and low-power 100Mbit/s powerline communications (PLC) chipset targeted at consumer networking applications.

DS2's Montgo is an extremely low-cost PLC solution providing a maximum datarate of 100Mbit/s.

Comprising the DSS8101U PHY/MAC SoC and the DSS7800 AFE IC, the chipset is specifically targeted at data networking in consumer applications including products designed for internet sharing, audio distribution and networking in the home.

Montgo offers full interoperability with DS2's highly successful UPA-DHS (Universal Powerline Association Digital Home Systems Standard) compliant 200Mbit/s product and future 400Mbit/s powerline products that deliver the higher performance levels required for video networking.

As with the 200Mbit/s Aitana announced last year, the new chipset was developed in conjunction with Toshiba's European LSI Design and Engineering Centre (ELDEC) in Dusseldorf.

In order to minimise time from initial design concept to volume production, ELDEC engineers used Toshiba's well established implementation platform.

In addition, by using Toshiba's advanced process technology and IP libraries, DS2 engineers were able to quickly integrate key onboard features including ADCs, DACs and PLL functionality.

Dr Jorge Blasco, President and CEO of DS2, comments: "The key to the development of the new PLC chipset was to deliver a high quality, advanced and low-power SoC solution in as short a time as possible while ensuring that the price was competitive for consumer applications".

"Having already supported us in the development of one highly successful 200Mbit/s PLC implementation we knew that Toshiba had the process technology, development platform and local engineering support that would allow us to meet all of these criteria".

Armin Derev/minanns, General Manager of the SoC Business Unit at TEE, adds: "This is another great example of how Toshiba's combination of technologies, development platforms and support can meet the needs of cutting edge fabless chip makers".

"Our open and advanced IDM model ensures that companies such as DS2 have access to the technology and development services needed to meet key performance, power and functionality specifications at the lowest possible cost in the shortest possible time".

"At the same time, our engineering teams can provide all necessary design implementation, consultancy and project management support".

Mr Tsutsui, Senior Manager from Toshiba Semiconductor Company, Custom SoC Group in Japan states: "Fabless chip makers are strategic to the growth of Toshiba's SoC business".

"This latest project shows how we are able to support such companies with every aspect of technology, design and development and on into final production".

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