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Product category: Memory Devices and Modules
News Release from: Toshiba Electronics Europe
Edited by the Electronicstalk Editorial Team on 13 June 2007
3D structure offers increased Flash
density
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Novel three-dimensional memory cell array structure does not rely on advances in process technology, and has minimal increase in the chip die size.
Toshiba has developed a novel three-dimensional memory cell array structure claimed to enhance both cell density and data capacity The cell does not rely on advances in process technology, and has minimal increase in the chip die size