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Product category: Discrete Power Devices
News Release from: Toshiba Electronics Europe | Subject: SOP Advance MOSFETs
Edited by the Electronicstalk Editorial Team on 03 December 2003

Novel package advances MOSFET power
density

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A new power MOSFET package from Toshiba has the same board mounting footprint and terminal configuration as a conventional SOP-8 device yet can handle almost three times as much current.

A new power mosfet package from Toshiba has the same board mounting footprint and terminal configuration as a conventional SOP-8 device yet can handle almost three times as much current Despite this, the SOP Advance package is 37% thinner than existing SOP-8 devices