News Release from: Thunderline Z
Edited by the Electronicstalk Editorial Team on 1 December 2003
Design guide aids feedthrough applications
A new design guide aims to help managers and technicians who are responsible for soldering feedthroughs into microwave packages.
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A new design guide aims to help managers and technicians who are responsible for soldering feedthroughs into microwave packages. The guide provides in-depth problems, causes and solutions to the ten most common soldering pitfalls installers encounter. Issues such as solder crystallisation, blow holes, airline obstructions, and solder voids are clearly detailed with four-colour illustrations, including what can happen if these soldering miscues get missed in final inspection.
"When you've been installing feedthroughs for as long as we have you encounter every possible scenario", said Debra Breed, Managing Director.
"When I realised our customers could benefit from our experience, we put together this guide so they could improve their yields and overall package performance".
The guide is 16 pages long and includes a discussion on the various feedthroughs Thunderline-Z offers and also technical discussion on a variety of advanced packaging techniques employed by Thunderline-Z.
It is available from the Thunderline-Z website.
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