Product category: Intellectual Property Cores
News Release from: Tensilica | Subject: Xtensa 7 and Xtensa LX2
Edited by the Electronicstalk Editorial Team on 14 December 2007
Processor cores put more into SoC
designs
Configurable processor families gain new hardware options and software tool enhancements to appeal to an even wider audience of SoC designers.
Tensilica has upgraded its two Xtensa configurable processor families (the Xtensa 7 and Xtensa LX2) with new hardware options and software tool enhancements that make it appeal to an even wider audience of SoC designers Highlights of these capabilities include a new, smaller general purpose register file option, new integer multiplier and divider execution unit options, two new Amba 3.0 bridge options, as well as an easy-to-use new configuration tool that analyses source C/C++ code and automatically suggests VLIW (very long instruction word) instruction extensions that lead to 30-60% improvements in general purpose code performance
This article was originally published on Electronicstalk on 30 Mar 2005 at 8.00am (UK)
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These new capabilities provide designers with the most productive configurable processor design environment, with automated features that ensure each processor design is correct by construction.
"This new product generation represents a significant enhancement of our Xtensa processor line in three dimensions - in support of even leaner deeply embedded 'data engine' configurations, in richer high-end system support, and in significantly enhancing our processor analysis, modelling, and software tools", explains Chris Rowen, Tensilica's President and CEO.
"Our Xtensa processors are already widely demanded".
Further reading
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Tensilica has claimed the highest score ever reported on the Networking Version 2.0 benchmark suite of the Embedded Microprocessor Benchmark Consortium (EEMBC).
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SoC cores take advantage of latest 90nm tools
Tensilica has enhanced its automated configurable processor design methodology to account for common integrated circuit design challenges with 90nm process technology.