Product category: Communications ICs (Wireless)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TD-SCDMA chipset solution
Edited by the Electronicstalk Editorial Team on 17 November 2004
TD-SCDMA chipset supports complex 3G
applications
Commit hand TI have developed a flexible TD-SCDMA chipset solution easily customised for supporting complex 3G applications.
Commit, a research and development joint venture with Chinese communications equipment manufacturers and Texas Instruments are driving 3G wireless innovation in Asia, providing the Chinese wireless industry with a flexible TD-SCDMA chipset solution easily customised for supporting complex 3G applications The TI and Commit solution incorporates TI's OMAP multimedia processors and digital signal processing (DSP) technology
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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