Product category: Analogue and Mixed Signal ICs
News Release from: Texas Instruments (April 2001-March 2006) | Subject: ADS527x family
Edited by the Electronicstalk Editorial Team on 4 February 2004
Eight-channel ADCs break new bounds
A family of octal 10 and 12bit high-speed analogue-to-digital convertors claims to set a new standard for integration, performance and power
A family of octal, 10 and 12bit, high-speed analogue-to-digital convertors claims to set a new standard for integration, performance and power. Featuring serial low-voltage differential-signalling (LVDS) outputs and consuming 123mW of power per channel at 65Msample/s (138mW/channel at 70Msample/s), the ADS527x family offers lower power than any competing product.
This article was originally published on Electronicstalk on 4 February 2004 at 8.00am (UK)
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The devices allow high system density in ultrasound, wireless communications, optical networking, instrumentation, test and measurement, and a variety of other multichannel applications.
'The innovative ADS527x family offers the highest level of integration and performance by providing eight parallel, 12bit ADCs with 70.5dB SNR at 70Msample/s.
By combining this integration with the lowest power per channel of competitive products, the ADS527x will enable higher channel counts and higher performance in applications such as ultrasound, PET and numerous other imaging and communications systems', said Ed Fullman, Product Marketing Manager for TI's high-speed data convertor products.
'Ultimately, these devices will allow designers to integrate more channels into smaller, more affordable systems - enabling advanced diagnostics in a broader range of environments around the world'.
The ADS527x family includes 40, 50, 65 and 70Msample/s versions in 12bit resolution, and 40, 50 and 65Msample/s versions in 10bit resolution.
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All products in this family are both pin and Serial LVDS compatible, providing a simple upgrade path in both sample rate and resolution.
Serial LVDS greatly simplifies the ADC interface and allows for compatibility between the different family members in terms of speed and resolution.
TI's implementation of serialised LVDS offers the user the flexibility to optimise interface power dissipation based on system requirements, and is compatible with Xilinx and Altera programmable devices.
Xilinx deserialiser source code is available as a free licence from Texas Instruments when used with TI data convertors.
The ADS527x family is optimised to work with TI's high-performance TMS320C6000T DSP platform, which is used in applications ranging from high-resolution medical imaging to third-generation wireless communications infrastructure.
In addition, depending on the application requirements, the ADS527x family is optimised for pairing with many of TI's high-speed op amps to achieve highest performance.
The integration, performance and power of the ADS527x family will allow imaging systems, such as ultrasound, to improve image quality with exceptional 12bit, 70.5dB SNR performance, reduce power requirements, increase channel density and decrease board space demands.
In wireless communications systems, such as basestations and picocells, the ADS527x family will improve system performance by reducing system complexity, handling more voice channels, reducing system form factors, increasing flexibility and lowering operating costs.
The ADS527x family offers exceptional signal-to-noise ratio (SNR) of 70.5dB (60.5dB for the 10bit family) at 10MHz input frequency.
The devices provide internal references to simplify system design requirements, or can be driven with external references.
The ADS527x family operates from a 3.3V supply.
All eight channels share a common sample clock for excellent skew and jitter performance.
Individual power down of each ADC channel enables optimised operation.
A peak-to-peak differential input range of 2V maintains signal integrity, and a common internal or external voltage reference allows excellent matching between channels.
Samples and evaluation modules of the ADS527x family are available now, with volume production scheduled for March 2004.
The devices are packaged in 80-lead TQFPs.
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