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Product category: Design and Development Hardware
News Release from: Texas Instruments (April 2001-March 2006) | Subject: HPA third party developer network
Edited by the Electronicstalk Editorial Team on 11 November 2003

Network aids leading-edge analogue applications

Anmerkung: Kostenlose Broschüren oder Kataloge zu den in diesen Pressemitteilungen aufgeführten Produkten sind erhältlich von Texas Instruments (April 2001-March 2006). Bitte hier klicken, um ein Exemplar anzufordern.

A new third party developer network and three application-focused demonstration platforms aim to speed adoption of TI high-performance analogue (HPA) products

'With a focus on developing tools that make it easier for our customers to choose and use high performance analogue products from TI, we are excited to announce these new resources', said Gregg Lowe, Senior Vice President for TI's High-Performance Analog Division. 'The demonstration platforms highlight TI's analogue and mixed-signal systems expertise and package it so designers have all the information they need to build a complete application-focused system.

The HPA Third Party Developer Network provides designers access to 'best fit' system solutions, developed and tested in collaboration with TI's third party developers'.

TI's platform technology works as a blueprint for designers, effectively decreasing design time by providing the customer with all schematics, Gerber plots, firmware, software, bill-of-materials - everything to rebuild the platform - and the documentation to understand it.

A cross between evaluation models, which are intended for general-purpose designs, and reference designs, which are optimised for individual applications, TI's platforms give engineers more time to invest in design, while lowering overall project cost by eliminating months of system integration.

The quad-channel thermal electric cooler platform demonstrates high-precision temperature regulation, within 0.1C, of four temperature channels (for example, EDFA pump lasers) using a single TMS320F2812 digital signal controller with an integrated 12bit analogue to digital convertor (ADC) and other HPA components, such as power management, signal conditioning, data acquisition and pulse width modulator (PWM) drivers.

Industrial control solutions via the CANbus demo platform include three demo boards interconnected through cables supporting the CANbus and demonstrating heat sensing, light intensity measurement, motor functions, and the industry's first 3.3/5V mixed-voltage CANbus capability using TI's SN65HVD230/251 CANbus transceivers.

The low-cost video interface demo platform shows how to connect a lower cost TMS320C6204, TMS320C6205 or TMS320C6711 DSP to TI's single- TVP5150 or multichannel TVP5145 video decoder through an inexpensive FPGA.

'The thermal electric cooler evaluation kit helped us to study capabilities of TI's F2812 digital signal controller as well as TI's power management devices suitable for the application.

We now have a better understanding of how to best utilise this to stabilise the temperature of our 3D scanner', said Alex Sherstuk, Engineering Manager for Basis Software.

'In addition we discovered that the F2812 digital signal controller can solve some issues with motion control in electromechanical laser deflection systems'.

With regard to motion control issues, the F2812 performance allows for more complicated algorithms which provide for motors to run with higher precision for smoother starts, less torque ripple and torque at sero speed.

In addition to the current platforms, a powerline energy metering system is under development for release in early 2004.

Building on the success of the TI DSP Third Party Network, which currently consists of more than 650 participating independent companies, the TI HPA Third Party Developer Network provides designers access to some of the most sophisticated systems knowledge available today.

TI's HPA third parties fall into three categories: device specific - pertaining to a specific HPA device; module specific - pertaining to more than one HPA device; and end equipment - pertaining to full end equipment development.

A complete list of TI's HPA third parties is available online.

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