Product category: Communications ICs (Wired)
News Release from: Texas Instruments (April 2001-March 2006)
Edited by the Electronicstalk Editorial Team on 04 November 2003
Open environment to cut cost of mobile
Java
Sun Microsystems and TI are working together to deliver optimised end-to-end wireless solutions for 2.5G and 3G networks.
Sun Microsystems and TI are working together to deliver optimised end-to-end wireless solutions for 2.5G and 3G networks The initiative marks the beginning of a collaboration that will help increase demand for converged voice and multimedia wireless devices, creating revenue-generating opportunities for OEMs, wireless operators and applications developers
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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