Product category: Analogue and Mixed Signal ICs
News Release from: Texas Instruments (April 2001-March 2006) | Subject: Analogue devices in NanoStar packages
Edited by the Electronicstalk Editorial Team on 14 October 2003
Analogue devices shrink
to NanoStar packages
Texas Instruments is now supplying a selection of analogue devices in its NanoStar wafer chip-scale packaging
Texas Instruments is now supplying a selection of analogue devices in its NanoStar wafer chip-scale packaging (WCSP). This advanced packaging technology shrinks package size, increases design flexibility and improves reliability without sacrificing performance - critical elements to delivering differentiated power management, amplifier and data converter products.
This article was originally published on Electronicstalk on 14 October 2003 at 8.00am (UK)
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Unlike plastic packages, NanoStar has no moulding compound, lead frame, wire bonds or leads.
Using standard surface-mount technology (SMT) assembly procedures, NanoStar can be mounted to a printed circuit board without additional under fill.
Other benefits include improved electrical performance, thinner package profile and high assembly yields.
TI's first power management ICs available in WCSP include the TPS793285, a new 200mA radio frequency (RF) low-dropout (LDO) regulator, and the TPS62000 95%-efficient DC/DC buck convertor that supports a 2 to 5.5V input voltage and up to 600mA output current.
The TPS793285 LDO is part of a successful family of low-power linear voltage regulators featuring high power supply rejection ratio (PSRR), ultralow noise, fast startup and excellent line and load transient responses.
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Now available in a five-ball NanoStar package measured at 0.84 x 1.348mm, the device provides an ultrasmall footprint and package weight, and supports various portable applications such as handsets and PDAs.
The OPA2347 is a dual operational amplifier featuring excellent speed/power ratio (20uA quiescent current/350kHz bandwidth), DC precision, low-voltage operation and rail-to-rail performance.
The combination of low-power consumption and an 8-ball NanoStar package, which measures only 1.008 x 2.100mm, is perfect for a variety of battery-powered applications such as cell phones, pagers, cameras, PDAs, and remote sensors.
Ideal for cellular handsets and PDAs, the TPA2010D1 is a 2W high-efficiency filter-free Class-D audio power amplifier that requires only three external components.
The device features high efficiency (87%), improved PSRR (-75dB) and through its fully differential architecture, the TPA2010D1 has excellent noise immunity.
Package dimensions being only 1.45 x 1.45mm, this device will also be the smallest Class-D audio power amplifier available on the market.
On release, the TPA2010D1 will be in a 9-ball NanoStar package with a lead-free option (NanoFree).
The TLV5614 is a quadruple 12bit voltage-output digital-to-analogue convertor (DAC) with a flexible serial interface, allowing glueless interface to TMS320, SPI, QSPI and Microwire serial ports.
Rail-to-rail output stage, power-down mode and NanoStar packaging, which measures only 2 x 2.7mm, make this device ideal for single-voltage, battery-based applications.
8, 10 and 12bit quad and octal DACs are also available in NanoStar.
TI was the first logic supplier to offer single, dual, and triple gate Little Logic devices in WCSP in 2001.
Low voltage CMOS (LVC) and advanced ultralow voltage CMOS (AUC) Little Logic functions are available in 5-, 6-, and 8-bump NanoStar packaging.
The 5-bump NanoStar devices, which offer a footprint of 1.26mm2, are 70% smaller than similar devices available in industry-standard SC-70 packages.
TI WCSP products will be available in both lead (NanoStar) and lead-free (NanoFree) ball options, providing alternative packaging solutions for environmentally sensitive manufacturing.
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