Product category: Analogue and Mixed Signal ICs
News Release from: Texas Instruments (April 2001-March 2006)
Edited by the Electronicstalk Editorial Team on 19 July 2002
New process on stream for 300mm wafers
Texas Instruments is now manufacturing customer-qualified 300mm wafers using its 130nm copper process technology in its DMOS 6 facility.
Texas Instruments is now manufacturing customer-qualified 300mm wafers using its 130nm copper process technology in its DMOS 6 facility The move to 300mm wafers and a 130nm process provides up to 2.4 times more die per wafer than 200mm and reduces production costs by 30-40% while delivering smaller, higher performance, lower power products
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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