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Product category: Communications ICs (Wired)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: TNETV3010
Edited by the Electronicstalk Editorial Team on 27 May 2002

VoIP multiprocessor intgrates
six DSPs and memory

The TNETV3010 multiprocessor integrates six ultra-high-performance TMS320C55x DSP cores and carries a full 24Mbit of on-chip SRAM - one of the largest integrated memories available today

More impressively, while consuming 50 times less power, the TNETV3010 contains over three times the transistor count of a high-performance PC processor on a die almost one-fifth the size. 'Texas Instruments is unique in the way they leverage semiconductor R and D and unique manufacturing processes to optimise chip designs and solve critical customer issues', said Dan Hutcheson, CEO and president of VLSI Research.

'The TNETV3010 is a good example because it allows TI's telecommunications customers to reduce power consumption, board-size and cost while simultaneously increasing network performance'.

In addition to high performance and low power consumption, a key requirement of voice over Internet protocol (VoIP) systems is the availability of large on-chip memories to handle vast amounts of channel data.

With its 24Mbit of on-chip SRAM, the TNETV3010 eliminates the need for external memory, thereby reducing system power dissipation and optimising board density and solution cost.

'TI's advanced 0.13 micron process enabled the TNETV3010 architecture to be conceived and optimized for the high density voice application', said Irvind S Ghai, high density voice manager, TI's VoIP Business Unit.

'Our industry-leading semiconductor manufacturing capability translates into more features and lower costs for customers via a unique silicon configuration that shares memory and peripherals across multiple cores.

The end result is a tiny, differentiated device with a simple programming model, enabling quick time to market'.

Important process and design innovations, such as TI's proprietary memory cell design, have contributed to the exceptional scale of the TNETV3010's on-chip memory.

The high-threshold voltage SRAM cell design is the most compact in its class, enabling much larger, lower power memories to be embedded within the area of the chip.

The on-chip SRAM is divided among the TNETV3010's six DSP cores, which take advantage of an innovative multiprocessing architecture to handle communications for over 200 VoIP channels.

In addition, with field-proven Telogy software included, the device provides carrier-class features for faster system development.

The TNETV3010 is in production today for telecommunications equipment manufacturers designing next generation equipment for the delivery of voice services over the same networks as data.

(This was Electronicstalk's Top Story on 24 May 2002).

(This was Electronicstalk's Top Story on 24 May 2002).

(This was Electronicstalk's Top Story on 24 May 2002).

(This was Electronicstalk's Top Story on 24 May 2002)

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