Product category: Standard Logic Devices
News Release from: Texas Instruments (April 2001-March 2006) | Subject: QFN-packaged logic
Edited by the Electronicstalk Editorial Team on 02 May 2002
QFN package is smaller and cooler than
TSSOP
Texas Instruments, IDT and Hitachi have combined to introduce 20-, 16- and 14-pin quad flat no-lead (QFN) packaging for gate and octal bit width logic devices.
Texas Instruments, IDT and Hitachi have combined to introduce 20-, 16- and 14-pin quad flat no-lead (QFN) packaging for gate and octal bit width logic devices Designers can take advantage of reduced form factors in personal digital assistants, cell phones, and other handheld consumer electronics, as well as in advanced networking and communications applications by using this package, which is up to 62% smaller compared with thin scale small outline packages (TSSOP) in the same bit widths
This article was originally published on Electronicstalk on 8 Nov 2004 at 8.00am (UK)
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