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Product category: Communications ICs (Wired)
News Release from: Texas Instruments (April 2001-March 2006) | Subject: Radvision SIP bundle
Edited by the Electronicstalk Editorial Team on 16 April 2002

VoIP bundle gains
session initiation protocol

Anmerkung: Kostenlose Broschüren oder Kataloge zu den in diesen Pressemitteilungen aufgeführten Produkten sind erhältlich von Texas Instruments (April 2001-March 2006). Bitte hier klicken, um ein Exemplar anzufordern.

Texas Instruments is to bundle Radvision's session initiation protocol (SIP) technology with its integrated silicon and software voice over Internet protocol (VoIP) for premise gateways and IP phones

This bundling enables TI customers developing enterprise IP phones, voice over IP (VoIP) residential/small office home office (SOHO) gateways and enterprise gateways to shorten and ease development time for their products. This offering expands the TI-Radvision relationship, as TI currently offers Radvision's H.323 and Megaco/H.248 enabling technology with its IP phone, residential/SOHO gateway and enterprise gateway solutions.

'Bundling Radvision's SIP enabling technology with our integrated VoIP solutions for IP phones, residential/SOHO gateways and enterprise gateways provides a complete solution for our customers to meet the needs of the market', said Bill Simmelink, general manager, VoIP Business Unit at Texas Instruments.

'SIP is a must-have for our customers and is an integral part of TI's voice strategy since it complements our portfolio of silicon and software solutions for the VoIP market'.

TI's IP phone and residential/SOHO/enterprise VoIP gateway solutions feature low-power, highly integrated processors with TI DSP cores, RISC processors, and Telogy Software.

TI's IP phone solution features the TMS320C5472 DSP and TI's TLV320AIC22 VoIP codec.

TI's VoIP residential/SOHO gateway solution features the integrated TNETV1010 solution and the VoIP enterprise gateway solution features the integrated TNETV2020 solution.

Bundling Radvision's SIP, H.323 and Megaco/H.248 enabling technology with TI's integrated solutions offers manufacturers all the system software and support needed for quick and easy development of IP phones and gateways.

For flexibility, customers can license a specific embedded Radvision toolkit that meets their development requirements.

'TI's solution with Radvision's SIP enabling technology provides customers an application framework that integrates SIP signaling and services, which shortens new product time-to-market and reduces development costs', said Gadi Tamari, CEO of Radvision.

'By integrating SIP into the chipset, the offering provides a solid foundation for the development of IP phones, residential/SOHO gateways and enterprise gateways'.

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