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Product category: Analogue and Mixed Signal ICs
News Release from: Texas Instruments (April 2001-March 2006) | Subject: SN65LVDS1023/1021 and SN65LVDS1224/1212
Edited by the Electronicstalk Editorial Team on 7 March 2002

Serdes devices go the distance

Texas Instruments has a new line of serialiser-deserialiser (serdes) solutions that permit a wider datarate, longer transmission distance and easier design than available products

Designed as drop-in replacements for existing market solutions, the new 10:1/1:10 serdes devices transmit data over high-speed backplanes using 25% less power than competitive devices. Among the applications that will benefit from these improved features are wireless base stations, data communications backplanes, video and industrial systems.

TI's SN65LVDS1023/1021 serialiser transmitters and SN65LVDS1224/1212 deserialiser receivers provide data throughput over low-voltage differential signalling (LVDS) backplanes at rates from 100 to 660Mbit/s.

TI's serdes products require less than 400mW of power at 660Mbit/s to convert 10bit words into single-bit data streams, transmit the data over cable or copper backplane media, then receive and reconvert the data into 10bit words again.

Featuring a flow-through pinout for ease of design, TI's new serdes solutions provide a second-source drop-in replacement for existing products in the market.

Unlike other devices, however, the TI solutions support a wider frequency range, from 10 to 66MHs, enabling designers to achieve a wider range of datarates in the same system.

In addition, an increase in voltage swing by 30% over competitive products supports greater backplane transmission distances.

Improved jitter characteristics help simplify board design and save system costs.

'TI's new low-power LVDS serdes products enable base station and other backplane customers to pack more channels into less space with best-ever cost effectiveness', said Atul Patel, high speed communications and controls product marketing manager at TI.

'Customers can come to TI for complete backplane solutions and system-level support that satisfy their current design needs while also providing a roadmap for future development'.

Other features of the LVDS serdes devices include synch mode and lock indicator that facilitate design, verification and troubleshooting.

Characterisation for the industrial temperature range of -40 to +85C makes the devices more widely useful in extreme environmental conditions.

The CMOS process used in manufacturing the devices lowers cost and offers the potential for integration with other CMOS functions as market requirements develop.

The new low-power serdes solutions complement TI's wide portfolio of serdes products, supporting data rates up to 10Gbit/s.

Customers who design with the low-power devices have available a range of serdes solutions from TI for future redesigns of their backplane products.

TI's new serdes solutions are available in a 28-pin shrink small outline package (SSOP).

Planned pricing for all devices is $5.40 each in quantities of 1000.

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