Product category: Standard Logic Devices
News Release from: Texas Instruments (April 2001-March 2006) | Subject: NanoStar logic packaging
Edited by the Electronicstalk Editorial Team on 20 June 2001
New package stars
in shrinking logic moves
Texas Instruments claims its new NanoStar packaging saves 70% of the space required for existing SC-70 (DCK) logic packages, providing a big advantage for portable consumer electronics
Texas Instruments claims its new NanoStar packaging saves as much as 70% of the space required for existing SC-70 (DCK) logic packages, providing a big advantage for portable consumer electronic devices. The first devices available in NanoStar packaging will offer the most popular logic functions for space-constrained systems such as wireless handsets, pagers, personal digital assistants, portable DVD players, MP3 players, notebook computers and other portable consumer electronics.
This article was originally published on Electronicstalk on 20 June 2001 at 8.00am (UK)
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NanoStar packaging will be first introduced in a 5-pin single-gate low-voltage CMOS (LVC) technology.
LVC dual-gate devices will follow in an 8-pin version.
These logic devices operate at 1.8V, and are optimised at 3.3V, providing low power consumption and medium current drive capability.
These devices allow designers the ability to place more functions in a tighter space while improving system performance.
With a footprint of 1.40 x 0.9 x 0.50mm (1.26mm2), NanoStar packaging offers a 13% reduction in size from any other alternative logic package solution and a 70% reduction over TI's previous single gate package, SC-70.
Designers will also realise improved thermal performance with the new NanoStar package over the SC-70.
This improved thermal performance benefits designers concerned with heat dissipation common in small, portable electronics.
NanoStar packaging is a leadless package option that makes use of five eutectic solder balls.
With a ball pitch of 0.5mm, these self-planarising balls allow minimal positional tolerance when placing the device on the board, thus enhancing manufacturability.
The first products in NanoStar packaging are sampling now with volume production scheduled for the fourth quarter of 2001.
Estimated resale pricing is $0.25 for quantities greater than 50,000 in 3000-part reels.
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