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Product category: Exhibitions, Courses, Conferences and Training
News Release from: Tektronix
Edited by the Electronicstalk Editorial Team on 19 April 2004

Seminar tour addresses
high-speed digital design

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A new signal integrity and power measurement seminar tour takes place in seven different European locations throughout April 2004

The technical seminars focus on signal integrity design issues that affect high-speed digital bus design in computing, networking and communications applications, as well as the application specific analysis tools that engineers require when conducting precise power measurements. Addressing the driving factors that cause signal integrity issues, the technical seminars include discussions regarding faster edge rates, tighter timing margins, greater complexity in the data stream (serial-packetisation) and lower power considerations (LVDS).

Responding to the need for precise power measurement, separate sessions demonstrate the importance of effective analysis tools to measure and analyse power dissipation in power supply switching devices and magnetic components, and generate detailed test reports in customisable formats.

This includes the new Tektronix TDSPWR3 software package that allows engineers to use Tektronix oscilloscopes for power applications.

Assisted by live demonstrations, the free one-day seminars will also provide the opportunity to view the latest Tektronix oscilloscopes, logic analysers, signal sources and probing solutions.

Design engineers will also gain insight into leading technology features, such as MagniView, iView and I-Connect, as well as the Pinpoint triggering and use of 0.18um silicon germanium (7HP SiGe) technology in the new Tektronix TDS6000B 8GHz bandwidth digital storage oscilloscope (DSO) series.

The tour will cover seven European venues in six countries throughout April 2004.

Countries and dates to remember include: 20th April, Munich, Germany; 21st April, Stuttgart, Germany; 20th April, High Wycombe, UK; 20th April, Helsinki, Finland; 21st April, Stockholm, Sweden; 27th April, Paris, France; and 28th April, Padova, Italy.

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