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Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits (HPCs).
As package density and technology drive the need for greater density on the printed circuit board, deep micro-via technology provides several benefits to printed circuit board designers.
Teradyne's unique HDI capabilities include panel sizes up to 24 x 28in and micro-vias three layers deep or 3mil in diameter.
By providing circuit designers with less manufacturing barriers, system costs can be reduced, along with layer count, by as much as 20%.
"With increasing complexity, density, format size and thickness of HPC designs, it was a logical next step for Teradyne's exceptional large format production expertise.
System architects can now review current and future platform decisions for significant cost optimisation potential", said Leigh Eichel, Teradyne Connection Systems HPC Marketing Manager.
"We have worked with leading companies to redesign systems, removing entire circuits, cabling and harnesses which yields significant programme cost savings.
Teradyne's large-format HDI capabilities include fine lines, thin cores, buried vias and micro vias.
With printed circuit design, connector selection, signal integrity simulation, electrical test and applications engineering throughout the design process, Teradyne provides system solutions, which encompass the entire signal transmission path, to meet performance and cost requirements for demanding applications.
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