Product category: Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: Hybrid electronics packages
Edited by the Electronicstalk Editorial Team on 07 November 2003
Ultraclean lids are critical to hybrid
success
Ensuring expensive hybrid electronics packages are encapsulated with an enclosure system that does not compromise the package or its contents has not traditionally been as easy as it may first appear.
Ensuring expensive hybrid electronics packages are encapsulated with an enclosure system that does not compromise the package or its contents has not traditionally been as easy as it may first appear Hybrid package lids are often manufactured by third parties and with varying degrees of compatibility
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
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