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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: 300 x 300mm wafer-bumping stencils
Edited by the Electronicstalk Editorial Team on 13 June 2003
Wafer-bumping stencils maintain accuracy
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Tecan is now producing stencils in the next-generation large format of 300 x 300mm, while maintaining close tolerance and high resolution across the whole image.
In addition to the supply of standard wafer-bumping stencils, Tecan is now producing stencils in the next-generation large format of 300 x 300mm, while maintaining close tolerance and high resolution across the whole image The ultra-accurate stencils are produced by electroforming, resulting in mirror-finish aperture walls, which ensure optimum solder paste release characteristics when depositing solder paste directly onto silicon wafer die