Product category: Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: Multilevel solder stencils
Edited by the Electronicstalk Editorial Team on 01 November 2002
Multilevel solder stencils aid
pin-in-hole reflow
As the PCB manufacturing industry increasingly adopts the beneficial concept of pin-in-hole reflow, Tecan continues to boost its share of this developing new market.
As the PCB manufacturing industry increasingly adopts the beneficial concept of pin-in-hole reflow, Dorset based stencil specialist Tecan, continues to boost its share of this developing new market, by providing feasible custom stencil solutions Pin-in-hole reflow (PIHR) is a technology aimed at PCB producers wishing to assemble both SMT and through-hole components on the same board
This article was originally published on Electronicstalk on 24 Oct 2000 at 8.00am (UK)
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