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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: Wafer-bumping stencils
Edited by the Electronicstalk Editorial Team on 15 November 2001
Wafer-bumping stencils deposit paste
accurately
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New-generation wafer-bumping stencils from Tecan Stencils Limited (TSL), are high-tolerance production aids which ensure optimum solder paste release characteristics.
New-generation wafer-bumping stencils from Tecan Stencils Limited (TSL), are high-tolerance production aids which ensure optimum solder paste release characteristics, resulting from mirror finish stencils with mirror finish aperture walls Wafer bumping stencils are used to accurately deposit solder paste directly onto silicon wafer die