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Product category: Boards and Backplanes
News Release from: Tecan | Subject: Semiconductor leadframes
Edited by the Electronicstalk Editorial Team on 22 May 2001
Electroformed leadframes are more
economical
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Tecan Components has developed new manufacturing techniques for the production of semiconductor leadframes, offering significantly higher specifications than traditional techniques.
Tecan Components has developed new manufacturing techniques for the production of semiconductor leadframes, offering significantly higher specifications than traditional techniques to produce economical parts with increased lead density and higher accuracy Traditional methods of leadframe manufacture include photochemical machining and machine punched parts for high-volume production needs, but the techniques have mechanical accuracy limitations