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Product category: Intellectual Property Cores
News Release from: Synopsys | Subject: DesignWare USB cores
Edited by the Electronicstalk Editorial Team on 02 September 2004
USB cores extend down to TSMC 90nm
process
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The latest additions to the DesignWare portfolio are a USB 2.0 On-The-Go PHY core for TSMC's 90, 130 and 180nm processes as well as an extension of the Hi-Speed USB 2.0 PHY core to the 90nm process.
The latest additions to the DesignWare portfolio are a USB 2.0 On-The-Go PHY core for TSMC's 90, 130 and 180nm processes as well as an extension of the Hi-Speed USB 2.0 PHY core product line to the 90nm process node The DesignWare USB 2.0 OTG PHY is the industry's first 90nm USB OTG PHY core
This article was originally published on Electronicstalk on 19 Apr 2001 at 8.00am (UK)