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Product category: Communications ICs (Wireless)
News Release from: RF Micro Devices | Subject: SiW3500
Edited by the Electronicstalk Editorial Team on 12 December 2003
Bluetooth chip runs on 0.18 micron RF
CMOS process
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UMC's 0.18 micron RF CMOS process technology is being used to manufacture Silicon Wave's single-chip Bluetooth IC, the SiW3500.
UMC's 0.18 micron RF CMOS process technology is being used to manufacture Silicon Wave's single-chip Bluetooth IC, the SiW3500 The SiW3500, introduced in November, is the newest addition to Silicon Wave's portfolio of single-chip solutions, which includes the SiW3000 and SiW1712 that are in full volume production at UMC and shipping to multiple customers today
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