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Product category: Analogue and Mixed Signal ICs
News Release from: Summit Microelectronics | Subject: S9518E
Edited by the Electronicstalk Editorial Team on 24 March 2004
DACPOT shrinks to ultra-chip-scale
package
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Summit Microelectronics can now supply its S9518E DACPOT in an ultra-chip-scale package (UCSP) with a total footprint of just 1.5 x 2.1mm.
Summit Microelectronics can now supply its S9518E DACPOT in an ultra-chip-scale package (UCSP) with a total footprint of just 1.5 x 2.1mm Summit offers this package where high-volume users demand the ultimate in board packing density
This article was originally published on Electronicstalk on 23 Apr 2001 at 8.00am (UK)
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