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Product category: Electronics Manufacturing Materials and Consumables
News Release from: StratEdge | Subject: G1010M-2C package
Edited by the Electronicstalk Editorial Team on 18 April 2008
Ceramic packages mitigate brazing
stresses
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StratEdge's thermally enhanced packages are designed for reliability and to mitigate the inherent stresses of brazing dissimilar materials together.
StratEdge has released a new family of small outline thermally enhanced moulded ceramic packages for power semiconductors The new line of packages can be used for silicon, silicon carbide, gallium nitride and other compound semiconductors in power-integrated circuit applications