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Product category: Memory Devices and Modules
News Release from: Spansion
Edited by the Electronicstalk Editorial Team on 02 February 2007
Flash development centre moves to 300mm
wafers
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Spansion's Submicron Development Centre has successfully completed its transition from 200 to 300mm wafers.
Spansion's Submicron Development Centre (SDC), the R and D headquarters for Spansion and the nucleus of the advanced manufacturing process for all Spansion Flash product lines, has successfully completed its transition from 200 to 300mm wafers Spansion is the only Silicon Valley company that has 300mm Flash memory in development and possesses the only 300mm R and D facility in California