Product category: Memory Devices and Modules
News Release from: Spansion
Edited by the Electronicstalk Editorial Team on 13 September 2006
PoP technology brings Flash to hand
Spansion is working with Freescale Semiconductor to produce package-on-package Flash memory for handset manufacturers.
Spansion is working with Freescale Semiconductor to produce package-on-package (PoP) Flash memory that will enable handset manufacturers to reduce wireless handset size and pack in more multimedia-rich features and functionality, such as digital video broadcast, video conferencing and location-based services Fully compliant with the JEDEC PoP standard, Spansion's Flash memory has been combined with Freescale's i.MX31 applications processor in a PoP solution
This article was originally published on Electronicstalk on 11 Nov 2004 at 8.00am (UK)
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Shrinking the size of mobile devices is made possible with Spansion and Freescale's combined PoP sol