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Product category: Memory Devices and Modules
News Release from: Solid State Supplies | Subject: CS-Stack
Edited by the Electronicstalk Editorial Team on 18 January 2002
New package provides stacks of memory
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CS-Stack is a novel technology from DPAC that allows mechanical stacking of chip-scale package memory devices using a fine-pitch ball grid array (FBGA) interface.
CS-Stack is a novel technology from DPAC that allows mechanical stacking of chip-scale package memory devices using a fine-pitch ball grid array (FBGA) interface The use of chip-scale packaging results in a significant reduction in the size of component packaging when compared with current thin small outline package (TSOP) style memory packages