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New Product information from SMART Modular Technologies
Date: 21 October 2002Company contact details

 
DDR modules inch into low-profile designs

SMART Modular Technologies has two new low-profile high-density DDR (double datarate) memory modules.

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SMART Modular Technologies has two new low-profile, high-density DDR (double datarate) memory modules.
SMART's 1Gbyte 184-pin ultra low-profile 1.0in registered DIMM supports a peak bandwidth of 2.128Gbyte/s and a data transfer rate of 266MHz/s per PIN meeting emerging high-end networking requirements.
Typical applications for this module include wireless basestations, gigabit routers, VOIP, enterprise servers, Edge routers and web server switches.
SMART's ordering part number is SM5722885D8ELCH01 (PC2100 CL2.5).
SMART's 1.25in 512Mbyte PC2700 ECC SO-DIMM is designed to meet common memory requirements for embedded computing applications as well as networking applications.
For single-board embedded computing applications, such as firewalls, home gateways, and fibre channel switch blades, one or two 512Mbyte SO-DIMMs mounted horizontally to meet sub-0.5in height limitations are usually required.
Concurrently, the ECC function is required for detecting and automatically correcting errors of one bit per word.
SMART's 512Mbyte SO-DIMM is configured as 64M x 72bit and can process data at up to 333MHz.
The ordering part numbers are SM572648FD8DWCL for PC2700 CL2.5 and SM572648FD8DWCH for PC2100 CL2.5 The 512Mbyte ECC SO-DIMM and the 1Gbyte 184-pin DIMM feature a 72bit wide databus used in many memory-intensive networking systems.
Each of these modules is designed to meet a x8 device databus requirement that NPUs (networking processors units), such as Broadcom's BCM1250 SiByte, place on the module.
To help maintain a lower cost structure, SMART has designed its two new low-profile, high-density modules using mainstream 256Mbit DDR technology, which allows SMART to take advantage of the semiconductor industry's volume pricing scales.
Typically, networking applications use 1.2in DIMMs to meet 1U (1.75in) space constraints.
These DIMMs are mounted with angled sockets since the height of the socket base combined with standoffs and minimum gap clearances between racks do not allow for vertical DIMM mounting.
However, some OEM designers are now incorporating vertically mounted low-profile registered DIMMs to reduce further the system's overall dimensions.
To remain compliant with 1U height constraints, OEM designers should use DIMMs that are shorter than the industry-standard height of 1.2in.
SMART's 1.0in registered DDR DIMM allows OEM designers to meet these height constraints while still supporting up to 1Gbyte of memory storage space on a single DIMM.
SMART expects to ship a 2Gbyte version of the 1.0in registered DIMM in Q1 2003.
 

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