Product category: Power Supply ICs and Controllers
News Release from: International Rectifier | Subject: Power management semiconductors in die form
Edited by the Electronicstalk Editorial Team on 30 June 2003
Power management semiconductors
come in die form
International Rectifier has set up a dedicated business group for power management semiconductors in die form
IR power devices in die form help customers gain a competitive edge by reducing weight and size, improving overall cost, enhancing thermal performance and increasing reliability. These enhancements can be an especially critical element of success in the automotive, wireless and industrial control markets.
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Robert Grant, Executive Vice President for International Rectifier said: "International Rectifier is relentlessly focused on addressing all of the needs of its customer base for high performance power management.
The formation of the new business group affirms our continued dedication to this mission, with an emphasis on helping our customers create their own, specially designed, application-specific end products".
In addition, the International Rectifier die sales business focus includes known good die (KGD), made with IR's SureChip process, ensuring the highest confidence that semiconductor devices comply with the complete specification range.
The company will market its die products under the International Rectifier brand name and continues to develop and expand its die sales support with technical performance and characterisation, testing options, sampling, mounting and bonding, shipment options and application notes.
Die is available in a wide variety of carrier (shipment) options such as probed wafer, sawn wafer on film, waffle pack/chip tray and tape and reel.
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