Product category: Discrete Power Devices
News Release from: International Rectifier | Subject: IRF6156
Edited by the Electronicstalk Editorial Team on 26 February 2003
Miniscule package for
bidirectional MOSFET pair
The IRF6156 is a 20V dual bidirectional HEXFET power MOSFET in a common drain configuration that is 80% smaller than devices in the TSSOP-8 package, with a profile less than 0.8mm
The IRF6156 is a 20V dual bidirectional HEXFET power mosfet in a common drain configuration that is 80% smaller than devices in the TSSOP-8 package, with a profile less than 0.8mm. The IRF6156 is housed in the International Rectifier proprietary FlipFET package. The small size makes the IRF6156 ideal for Li-ion battery pack safety and protection circuits for cellphones, notebook computers, PDAs and digital cameras.
This article was originally published on Electronicstalk on 26 February 2003 at 8.00am (UK)
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Li-ion battery packs are flammable, and require protection circuits to prevent damage from overcharging.
A protection circuit is also required to detect a short circuit condition, and disconnect the battery from the load.
The proprietary FlipFET package uses no lead frame or mould compound.
In essence, the die is the package, and reduces thermal resistance from junction-to-PCB to 35C/W compared with at least 60C/W for SO-8 package devices.
In addition, maximum thermal resistance junction-to-ambient is 50C/W.
All the IRF6156 terminals are on a single side of the die, so stray inductance and other device packaging losses are minimised or eliminated.
IR's FlipFET mosfets accommodate the ever-shrinking form factors of handheld applications without sacrificing current carrying capability.
Standard surface mount equipment and techniques can be used to mount the new device on a PCB.
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