Click on the advert above to visit the company web site
Product category: Boards and Backplanes
News Release from: Schroder-Plast | Subject: 3D-MID
Edited by the Electronicstalk Editorial Team on 12 November 2003
Novel approach to 3D circuitry
Request your FREE weekly copy of the Electronicstalk email newsletter. News about Boards and Backplanes and more every issue. Click here for details.
A technology breakthrough has opened a new low-cost and rapid method for manufacturing single prototypes and short runs of both flat and 3D-formed printed circuit boards.
A technology breakthrough has opened a new low-cost and rapid method for manufacturing single prototypes and short runs of both flat and 3D-formed printed circuit boards The new technology is based on thermoplastic bodies, manufactured by free forming, such as selective laser sintering (SLS) or fused deposit modelling (FDM)