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Product category: Electronics Manufacturing Services
News Release from: Schroff UK | Subject: Systems integration
Edited by the Electronicstalk Editorial Team on 18 October 2005
Packaging hosts full systems integration
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Schroff has developed new systems integration capabilities that include complete assembly and test of electromechanical and electronic components.
Electronic packaging is now more than just supplying empty cabinets and cases Schroff has developed new systems integration capabilities that include complete assembly and test of electromechanical and electronic components, such as cabling, switches, backplanes, power supplies, monitoring units, cooling concepts and EMC measures in an electronics cabinet or case