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Product category: Instrument Cases, Benchtop and Wall-Mounting Enclosures
News Release from: Schroff UK | Subject: Packaging solutions for AdvancedTCA
Edited by the Electronicstalk Editorial Team on 12 February 2003
Packaging solutions for AdvancedTCA
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Schroff has released a full-colour four-page catalogue detailing the new line of packaging solutions for AdvancedTCA, the forthcoming PICMG 3.0 specification.
Schroff has released a full-colour four-page catalogue detailing the new line of packaging solutions for AdvancedTCA, the forthcoming PICMG 3.0 specification being developed by the PCI Industrial Computers Manufacturers Group (PICMG) The new catalogue includes features and technical specifications for Schroff's new ATCA backplane and 12U development system, both available in 14-slot, full mesh co