Product category: Electronics Manufacturing Machinery and Materials
News Release from: RTP Company | Subject: PermaStat Plus
Edited by the Electronicstalk Editorial Team on 23 October 2001
Plastics stay static free for protective packaging
RTP Company has expanded its PermaStat range of permanently antistatic compounds with the release of PermaStat Plus.
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RTP Company has expanded its PermaStat range of permanently antistatic compounds with the release of PermaStat Plus. By employing advanced compounding techniques PermaStat Plus materials boost mechanical or electrical properties in various applications that require protection from static buildup. PermaStat Plus compounds are available in "E-Series" (for improved electrical dissipative performance) and "M-Series" (for improved mechanical property performance).
PermaStat Plus compounds will initially be available in acrylic, ABS, clear ABS, acetal and polyethylene resin systems.
RTP Company's all-polymeric PermaStat and PermaStat(r) Plus compounds provide important antistatic properties for applications requiring dust-free and static-free environments such as clean-rooms for the manufacture of medical products or electronic devices.
All PermaStat and PermaStat Plus products are non-sloughing, carbon particle free, surface resistance is 10E7-10E8ohm, and have excellent static decay properties.
The complete family of PermaStat and PermaStat Plus compounds offers significant benefits over fragile, post-applied surfactant coatings.
PermaStat and PermaStat Plus static dissipative properties are inherent in the moulded material, eliminating costly, time-consuming secondary coating steps and solving problems in applications where other antistatic agents can be removed by material movement, cleaning agents or evaporation.
PermaStat and PermaStat Plus compounds are suitable for injection molding, extrusion, blown film, thermoforming and blow molding.
Typical applications include electronics packaging for clean room devices, tubing, zip bags, wafer transport and storage devices, clean room bottles for flux and DI water dispensing, IC transport devices, disk drive components and packaging, explosive and flammable products storage and transport devices.
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