Click on the advert above to visit the company web site
Product category: Electronics Manufacturing Materials and Consumables
News Release from: Rogers Corp
Edited by the Electronicstalk Editorial Team on 10 January 2006
Circuit materials show up at DesignCon
West
Request your FREE weekly copy of the Electronicstalk email newsletter. News about Electronics Manufacturing Materials and Consumables and more every issue. Click here for details.
Rogers will showcase its R/flex 3000 and RO4000 Series circuit materials for advanced packaging applications at this year's DesignCon West.
Rogers will showcase its R/flex 3000 family of liquid crystalline polymer (LCP)-based circuit materials and RO4000 Series high frequency circuit materials for advanced packaging applications at this year's DesignCon West The R/flex 3000 family of liquid crystalline polymer (LCP)-based circuit materials includes the R/flex 3600 LCP single-clad laminate and the R/flex 3850 double-clad laminate