Product category: Electronics Manufacturing Machinery and Materials
News Release from: Rogers Corp | Subject: 2L-FCCL API flexible circuit materials
Edited by the Electronicstalk Editorial Team on 14 November 2005
Adhesiveless all-polyimide flex circuit materials
Rogers Corp is showcasing its 2L-FCCL adhesiveless, all-polyimide (API) flexible circuit materials for use in cellphone hinge flex and other applications, at this year's Productronica
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Rogers Corp is showcasing its 2L-FCCL adhesiveless, all-polyimide (API) flexible circuit materials for use in cellphone hinge flex, LCD interconnection, and other applications, at this year's Productronica. Offerings include Rogers R/flex AP 200 material, a single-clad, cast-on type product and Mitsui Chemicals Neoflex NFX material, a double-clad, laminated-type product.
Both are available in rolls 250mm and 500mm (9.84 inches and 19.68 inches) wide.
The new adhesiveless products are polyimide-based, made by directly bonding polyimide onto adhesion-treated copper foil, without the use of conventional adhesives.
Since these laminates are manufactured without the use of adhesives, they are ideally suited for the manufacturing of circuits intended for use in high-density designs, harsh working environments, dynamic flexing applications as well as thin multilayer and rigid-flex circuits.
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Product features and benefits include: excellent solder resistance, ideal for lead-free soldering temperatures; thinner cross-section than laminates with adhesives, allowing smaller bend radius and high cycles in hinged applications; inherently flame-resistant, halogen-free (green) with a flammability rating of UL 94V-0; and excellent dimensional stability, for use in making fine line flexible circuit designs and assemblies.
These materials are also compatible with Rogers' other fine R/flex adhesive-based materials and covercoats.
Other products to be featured at the show will include Rogers' full range of RT/Duroid products as well as R/flex Crystal Flexible Circuit Materials.
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